5W, accounting for 91. This is because the rapid flow of air takes away the heat conducted from the chip to the surface of the large cold plate. The downward trend of temperature will slow down. At m-2K-1, the large junction temperature is 83. When m-2K-1, it can withstand a high-power chip of 32W and a low-power chip of 0.

If the high temperature of the chip is less than 85°C as the design standard, it can be known through simulation calculation that for the high-power microwave components embedded in the LTCC of this structure, the forced convection coefficient in the air is bucket mould factory 160W. The forced convection coefficient of cold rolled coil is 150W in air. Using forced air convection can significantly reduce the large junction temperature of the overall model.414℃, and the heat dissipation through the large cold plate convection is 30.　　 When the air forced convection coefficient reaches 160W.

These research results are of great significance to the chip thermal design of high-power microwave components. This is mainly because the internal thermal resistance from the heating junction temperature in the microwave component to the environment restricts the heat dissipation channel. This requires optimized selection from chip materials, internal packaging materials and structures to further reduce the large junction temperature.9 of the overall heat dissipation, mainly because the large cold plate has a large contact area with the environment, and Its thermal conductivity is large.

A common measure to enhance heat dissipation is proposed: forced air convection is applied to the bottom of the large cold plate, and the heat distribution of the microwave component model in this case is simulated.8W.. With the increase of the air forced convection coefficient, the large junction temperature shows a downward trend. The relationship between the overall junction temperature and the forced convection coefficient of different air

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